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林业科学 ›› 2011, Vol. 47 ›› Issue (9): 129-134.doi: 10.11707/j.1001-7488.20110922

• 论文 • 上一篇    下一篇

利用苯酚液化大豆粉制备耐水性木材胶黏剂

高振华, 顾继友   

  1. 东北林业大学材料科学与工程学院 哈尔滨 150040
  • 收稿日期:2009-12-09 修回日期:2010-05-26 出版日期:2011-09-25 发布日期:2011-09-25

Water Resistant Wood Adhesives Prepared with Phenolated Soy Flours

Gao Zhenhua, Gu Jiyou   

  1. Material Science and Engineering College, Northeast Forestry University Harbin 150040
  • Received:2009-12-09 Revised:2010-05-26 Online:2011-09-25 Published:2011-09-25

摘要:

以硫酸/磷酸为催化剂和苯酚液化,将大豆粉转化为胶黏剂的制备原料,并制备得到耐水性木材胶黏剂。采用GPC,HPLC,FTIR等手段结合胶合板压制,对豆粉苯酚液化产物及其与甲醛缩聚得到的胶黏剂进行表征。结果表明: 以苯酚/豆粉质量比为3/1~2/1、5%硫酸为催化剂下,将豆粉在130~150 ℃下液化90 min,90%以上的豆粉转化成相对分子质量为250~7 250的产物,部分苯酚以1,4-取代和1,2-取代方式与豆粉反应形成结合酚; 苯酚液化不仅破坏大豆蛋白的紧密球形结构,还使液化豆粉的活性基团增加,由此通过苯酚液化豆粉与甲醛缩聚,制得低游离甲醛释放的、胶接性能满足国家标准要求的Ⅰ类胶黏剂,由此所制备胶合板的28 h煮-烘-煮湿强度在1.24~1.81 MPa之间,达到耐候胶合板要求; 苯酚/豆粉的比例对液化产物以及苯酚液化豆粉-甲醛胶黏剂的许多特性都有不同的影响,其中以苯酚/豆粉比例为3的胶黏剂胶接强度最好。

关键词: 豆粉, 苯酚液化, 木材胶黏剂, 表征

Abstract:

By means of phenol liquefaction (or phenolation) in the presence of sulfuric/phosphoric acids as catalyst, the soy flour translated into raw material for water-resistant wood adhesive. The techniques of GPC, HPLC, FTIR and plywood evaluation were employed to characterize the phenolated soy flours (PSF) and the PSF-formaldehyde (PSFF) adhesives. It indicated that more than 90% of soy flour translated into phenolated resultants with molecular weight ranged 250-7 250 after the soy flour liquefied at 130-150 ℃ for 90min with phenol/soy flour ratio ranged from 3/1 to 2/1, and some phenol was bonded to soy flour via 1,4- and 1,2- substitutions after liquefaction. Phenolation not only unfolded the globular structure of soy protein but also increased the quantity of reactive groups in PSF, therefore a low-free-formaldehyde adhesive with good bond strength and water resistance was prepared with PSF. The plywood panels manufactured with the PSFF adhesives resulted in 28 h boiling-dry-boiling wet bond strength from 1.24 to 1.81 MPa. The phenol/soy flour ratio had various effects on the many properties of phenolated soy flour and PSFF adhesives, and the PSFF adhesive prepared with phenol/soy flour ratio of 3 had the best bond strength.

Key words: soy flour, phenol liquefaction, wood adhesive, characterization

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