Scientia Silvae Sinicae ›› 2009, Vol. 12 ›› Issue (7): 169-174.doi: 10.11707/j.1001-7488.20090730
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Lu Keyang1,Fu Feng1,Cai Zhiyong2,Zhang Enjiu3
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copper fiber; urea formaldehyde resin; conductive sheet; percolation threshold effect; three-dimensional conductive network
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Lu Keyang;Fu Feng;Cai Zhiyong;Zhang Enjiu. Conductive Properties of UF Adhesive Sheets Filled with Copper Fiber[J]. Scientia Silvae Sinicae, 2009, 12(7): 169-174.
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