Abstract:

Abstract： In order to know the dynamic viscoelastic properties of silicon dioxide/wood composite, their transition temperature and loss tangent of relaxation process was studied with differern weight percentage gain (WPG) by dynamic mechanical analysis(DMA). The research result showed that: the number of relaxation process of silicon dioxide/wood composite was less than that of untreated wood. The transition temperature of α relaxation process for silicon dioxide/wood composite made by sol\|gel moved towards high temperature with increasing WPG.The transition temperature of α relaxation process of WPG(0，5.10%，28.00%) was 75.2，76.8，93.6 ℃ respectively. The value of α relaxation process peak decreased, and the loss tangent of α relaxation process of WPG(0，5.10%，12.63%，28.00%) was 0.043，0.041，0.033，0.03 respectively. However, the onset temperature of αrelaxation process moved towards low temperature with increasing WPG for silicon dioxide/wood composite made by SCAsolgel. And their α relaxation process onset temperature of WPG(6.61%，8.08%，10.58%) was 44.9，410，32.2 ℃ respetively.

Key words: Key words： silicon dioxide/wood composite, dynamic viscoelastic properties, relaxation process, loss tangent