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Scientia Silvae Sinicae ›› 2007, Vol. 43 ›› Issue (11): 89-92.doi: 10.11707/j.1001-7488.20071116

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Electroless Deposition of Ni-Cu-P Alloy on Fraxinus mandshurica Veneer

Li Jian,Wang Lijuan   

  1. Key Laboratory of Bio-Based Material Science and Technology of Ministry of Education,Northeast Forestry University Harbin 150040
  • Received:2007-01-09 Revised:1900-01-01 Online:2007-11-25 Published:2007-11-25

Abstract:

Ni-Cu-P alloy was deposited on Fraxinus mandshurica veneer by using electroless plating. The effects of pH value and plating temperature on electromagnetic shielding effectiveness were investigated. The structure and composition of each layer were analyzed by X-ray diffractometer(XRD) and energy dispersion spectrometer(EDS) respectively. And surface features of plated veneer were observed by scanning electron microscopy(SEM). The results show that the structures of each layer obtained under pH value in the range from 8.5 to 9.5 are microcrystalline. However, the compositions of copper and phosphorus in the layers under different pH value are different. The compositions of copper and phosphorus are 9.73% and 1.70% respectively and the electromagnetic shielding effectiveness of plated veneer is up to 50 dB at frequencies from 9 kHz to 1.5 GHz when pH value of the plating solution is 9.25.The structures of layers obtained under invariable pH value and temperature from 60 ℃ to 72 ℃ are all microcrystalline. And the electromagnetic shielding effectiveness of plated veneer is highest. It was found at 63 ℃ by SEM that the surface of wood is covered by uniform compact layer and has remarkable metallic luster.

Key words: veneer, electroless plating, Ni-Cu-P alloy