Scientia Silvae Sinicae ›› 2007, Vol. 43 ›› Issue (02): 89-95.doi: 10.11707/j.1001-7488.20070216
Previous Articles Next Articles
Zhou Xiaoyan1,Li Jian2,Zhou Dingguo1
Received:
Revised:
Online:
Published:
Abstract:
The heat-conducting property of the wheat straw-based sandwich wallboard was evaluated with finite difference method and intergal transformation method and compared with the traditional construction brick wall in this paper. The results indicated that the wheat straw-based sandwich wallboard had better property of withstanding the difference of the outdoor environment than the brick wall, which was about 8~10 times of brick wall. In addition, the heat conductance of the wheat straw-based sandwich wallboard can meet the national demand of 50% energy saving of new building materials. It has good heat insulation and can be used either in interior or exterior for buildings and will have a bright future in China.
Key words: the wheat straw-based sandwich wallboard, heat-conducting property, finite difference method, intergal transformation method
Zhou Xiaoyan;Li Jian;Zhou Dingguo. Simulation Evaluation of the Heat-Conducting Property of Wheat Straw-Based Sandwich Wallboard[J]. Scientia Silvae Sinicae, 2007, 43(02): 89-95.
0 / / Recommend
Add to citation manager EndNote|Reference Manager|ProCite|BibTeX|RefWorks
URL: http://www.linyekexue.net/EN/10.11707/j.1001-7488.20070216
http://www.linyekexue.net/EN/Y2007/V43/I02/89