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林业科学 ›› 2009, Vol. 12 ›› Issue (3): 101-104.doi: 10.11707/j.1001-7488.20090318

• 论文 • 上一篇    下一篇

二氧化硅/木材复合材料的动态黏弹性

符韵林1,2赵广杰3   

  1. (1. 东北林业大学材料科学与工程学院 哈尔滨 150040; 2. 广西大学林学院 南宁 530004;3. 北京林业大学材料科学与技术学院 北京 100083)
  • 收稿日期:2007-12-14 修回日期:1900-01-01 出版日期:2009-03-25 发布日期:2009-03-25

Dynamic Viscoelastic Properties of Silicon Dioxide/Wood Composite

Fu Yunlin1,2,Zhao Guangjie3   

  1. (1. College of Material and Engineering,Northeast Forestry University Harbin 150040; 2. Forestry College,Guangxi University Nanning 530004;3.School of Material Science and Technology, Beijing Forestry University Beijing 100083)
  • Received:2007-12-14 Revised:1900-01-01 Online:2009-03-25 Published:2009-03-25

摘要:

为弄清二氧化硅/木材复合材料的动态黏弹性,通过动态热机械分析仪研究不同增重率的二氧化硅/木材复合材料松弛过程的转变温度及力学损耗角正切的变化。结果表明: 二氧化硅/木材复合材料的松弛过程数量减少,直接溶胶-凝胶法制备的二氧化硅/木材复合材料,α松弛过程的转变温度随着增重率的增加而向高温方向移动,增重率为0,5.10%和28.00%的α松弛过程的转变温度分别为75.2,76.8和93.6 ℃;α松弛峰的峰值减小,增重率为0,5.10%,12.63%和28.00%的α松弛过程的损耗角正切值分别为0.043,0.041,0.033和0.03。加硅烷偶联剂法制备的二氧化硅/木材复合材料,随着增重率的增加,α松弛过程的起始温度向低温方向移动,增重率为6.61%,8.08%和10.58%的α松弛过程的起始温度分别为449,41.0和32.2 ℃。

关键词: 关键词: 二氧化硅/木材复合材料, 动态黏弹性, 松弛过程, 损耗角正切

Abstract:

Abstract: In order to know the dynamic viscoelastic properties of silicon dioxide/wood composite, their transition temperature and loss tangent of relaxation process was studied with differern weight percentage gain (WPG) by dynamic mechanical analysis(DMA). The research result showed that: the number of relaxation process of silicon dioxide/wood composite was less than that of untreated wood. The transition temperature of α relaxation process for silicon dioxide/wood composite made by sol\|gel moved towards high temperature with increasing WPG.The transition temperature of α relaxation process of WPG(0,5.10%,28.00%) was 75.2,76.8,93.6 ℃ respectively. The value of α relaxation process peak decreased, and the loss tangent of α relaxation process of WPG(0,5.10%,12.63%,28.00%) was 0.043,0.041,0.033,0.03 respectively. However, the onset temperature of αrelaxation process moved towards low temperature with increasing WPG for silicon dioxide/wood composite made by SCAsolgel. And their α relaxation process onset temperature of WPG(6.61%,8.08%,10.58%) was 44.9,410,32.2 ℃ respetively.

Key words: Key words: silicon dioxide/wood composite, dynamic viscoelastic properties, relaxation process, loss tangent