Abstract:

Water—unsoakes and Water—soaked dry—procesed binderless hsrdboards sre observed by scanning electron microsope to acquire informations on the binderless hardboardinternal structure.This may be helpful in a beter understanding of strength and water proof properties of the binderless hardboard.In nanufacturing hardboard, he wood fibers break apart at the middle lamella and come in contact again when subjected to pressure during hot—pressing. The physical and mechanical properties of the haraboaed areconditioned bg coming in conact extent again of wood fibers.Electron microscopical observations on the inderless hard-boards show that the wood fibers are omtercrossed and bonded xlosely.Even if watersoaked, he bond of the wood fibers does not appera a loose siuation.The result of the electron microscopy study shows the dry-procesed hardboard winthout any adhesive Subtances can possess superior strength and waterproof properties.

Key words: Dry—procesed hardboard, Binderless, Structure, Structure, Electron microscopy